The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

The facility, located within the chipmaker’s expansive Malta campus, will aid the company’s plans to create a U.S.-based, end ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Chip manufacturing giant GlobalFoundries has announced plans to spend upwards of $700 million establishing a new silicon ...

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging ... support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings ...

While third-party chiplets create integration challenges, they offer cost savings and flexibility. Companies like Intel and AMD are leveraging new interconnects, PHYs, and 3D stacking to optimize ...

Shares of Nvidia Corp. ( NVDA, Financial) fell more than 3% on Friday as investors worried about growing competition from ...

A De Beers subsidiary claims that it can manufacture composite heatsinks with insane thermal conductivity in complex shapes.

Special Report: What’s Next For Through-Silicon Vias: Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging ...