EurekAlert!3y
Figure 1. State-of-the-art 2.5D package design versus 3D functional interposer design (IMAGE)
The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance.
Design-Reuse1y
Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
Hsinchu, Taiwan -- Sep. 12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...
Design-Reuse7mon
Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
1 The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection ...
Dataquest5d
Advanced packaging: How AI is revolutionizing the game?
High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...