"When commercially viable 3D DRAM is available and die stacking challenges such as thermal management have been further addressed, this would be good news for HBM providers as it introduces memory ...

explains Dr. Ken Chen, president of GUC. "3D die stacking technology will start a revolution in the way we design HPC, AI and Network Processors. Die-to-die interface is not limited any more to the ...

Subtracting the 50µm die stack (CCD, SRAM, and BEOL ... Despite losing its gaming throne to AMD, Intel has no plans to counter AMD's 3D V-Cache technology, at least for the mainstream segment.

Intel has revealed some of the innovations it will be putting to use in its upcoming processors, with the introduction of higher-performance Sunny Cove microarchitecture and 3D die stacking for ...

IGAD2DY02A is a GLink-3D high speed die-to-die interface Master PHY. It is used to transmit data between dies and assembled using TSMC System on Integrated Chips (SoIC) 3D stacking technology ...