Large Language Models Mr Vaishnaw said India is working with stakeholders on two more items which will form the next phase of the AI mission - getting a homegrown AI chip designed, and having an ...
At the beginning of the year, Samsung and Google announced Eclipsa Audio, a 3D audio format meant to rival Dolby Atmos. The new spatial audio tech is supposed to arrive in Samsung's 2025 TV and ...
The fourth-generation iPhone SE will be equipped with a chip that has an identifier of T8140, according to a private account on social media platform X. That identifier is used by both the A18 and ...
With many touting the AI revolution as the next great economic shift, there’s no doubt that certain chip stocks are going to benefit more than others from these trends. This list of the top chip ...
According to a new leak, the chip design for the future PlayStation ... where users are discussing the potential adoption of 3D V-Cache technology. The new console may leverage AMD's "Halo ...
The Biden administration last week unveiled rules that will limit the flow of advanced AI chips from US companies to all but 18 countries. Countries that will not have any access to US chips ...
TAIPEI -- Taiwan Semiconductor Manufacturing Co. was working to assess the impact of a 6.4-magnititude earthquake on its most advanced chip production hub on Tuesday morning, with workers ...
BRUSSELS — Poland’s government is up in arms over a U.S. move to limit the export of artificial intelligence chips to the country — something that could impact Warsaw’s AI ambitions just as it seeks ...
With a new MacBook Air just around the corner, Apple is still in the process of rolling out its range of M4 chips. But that hasn’t stopped speculation mounting about the upcoming M5 chip ...
The Biden administration has already awarded tens of billions of dollars under the bipartisan CHIPS and Science Act passed in 2022 for the purpose of boosting domestic semiconductor production ...
While the chip war focused on producing the most powerful hardware, the data war hinges on acquiring the right datasets to train AI. The growing scarcity of ethical, high-quality data poses a ...
A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...
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