Semiconductor Engineering3y
Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems
“More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based ... Methodology ...
Hackaday3y
multi chip module
ECU from a 2010 Volkswagen Golf Mk6 module (which rides on the back of the three-phase steering rack motor) being cracked open to reveal an interesting multi-chip module approach, with bare die ...
CNN2y
POET Technologies Inc.
It developed POET Optical Interposer platform, which allows the integration of electronic and photonic devices into a single multi-chip module. The company was founded on November 14, 1985 and is ...
Design-Reuse4y
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC ...