Semiconductor Engineering3y
Future Challenges For Advanced Packaging
Michael Kelly, vice president of advanced packaging development and integration at Amkor ... or even larger pitches if it’s an MCM (multi-chip module). Once again, there are going to be two tiers. The ...
Design-Reuse22d
White Electronic Designs Awarded $1.9 Million Contract for System-On-Chip Microprocessor Modules for Air-to-Air Missiles
White's products include advanced semiconductor packaging of high-density memory products and state-of-the-art microelectronic multi-chip modules for military and defense industries and data and ...
Seeking Alpha21d
BESIY BE Semiconductor Industries N.V.
BE Semiconductor Industries ... multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems ...
Design-Reuse13d
Inapac Technology Unveils Breakthrough Solution for Integrating DRAM in System-in-Package, Multichip Applications
May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...
TechSpot27d
Nvidia's data center customers are postponing Blackwell chip orders due to overheating and other issues
The complex multi-chip module design, which integrates two large GPU dies on a single package, further exacerbates the heat management challenges. As deployments scale, with configurations ...