The SGET embedded standardization body is hammering out a standard for FPGA-on-modules. Discover the benefits and how the new ...

A Key Part of High-Performance Compute: Summary Heterogeneous integration and AI are advancing together, driving high-performance computing with m ...

South Korean memory makers SK Hynix and Samsung Electronics both saw their exports of multi-chip packages (MCP) fall ...

Q1 2025 Earnings Call Transcript February 6, 2025 MACOM Technology Solutions Holdings, Inc. beats earnings expectations.

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Industry growth reports; new GF CEO; UVM for mixed signal; power demands explode; EU-US chip collaboration; earnings; S Korea ...

In the wake of AI, unprecedented demand for data and computing power is outstripping capabilities. This will drive the ...

He told senators that the CHIPS Act is an “excellent down payment” and repeatedly emphasized the importance of revitalizing US semiconductor manufacturing. Howard Lutnick, US President Donald Trump’s ...

The semiconductor industry is expected to see continued demand for artificial intelligence chips in 2025, while legacy segments could stabilize after a period of oversupply, according to a report from ...

The M6 chip may also incorporate Wafer-Level Multi-Chip Modules (WLCM), a technology that enhances thermal management and enables greater compactness. This advancement would allow Apple to create ...