Michael Kelly, vice president of advanced packaging development and integration at Amkor ... or even larger pitches if it’s an MCM (multi-chip module). Once again, there are going to be two tiers. The ...

BE Semiconductor Industries ... multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...