Handheld electronic devices are vulnerable to drop impacts, leading to mechanical damage and electrical failures such as PCB cracking, trace damage, solder joint fractures, and component breakage.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB ... BGA ...

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By leveraging innovations like AI, digital twins, and edge computing, manufacturers can achieve improved product quality, efficiency, and scalability.

Operator Welcome to the fourth quarter 2024 Arista Networks financial results earnings conference call. During the call, all participants will be in a listen-only mode. After the presentation, we will ...

OXFORD, CT – MIRTEC, the ‘Global Leader in Inspection Technology’, is proud to announce its participation in the 2025 IPC APEX EXPO. The premier event for the electronics manufacturing industry will ...

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

Underfill also improves thermal cycling performance, prevents moisture ingress, and mitigates the risk of solder joint failure, thereby extending the lifespan of electronic components. Essemtec’s ...

Surface mount devices have gotten really small, so small that a poorly timed sneeze can send your 0603 and 0402 parts off to ...

The Board of Control for Cricket in India's (BCCI) directive not to sport Pakistan in their jerseys for the upcoming ICC Champions Trophy 2025 has left the Pakistan Cricket Board (PCB) fuming.

WOOSTER, OH— February 2025 — RBB Systems, a trusted leader in electronics manufacturing since 1973, is proud to announce the acquisition of the Fancort Industries PHM1-1 Hot Bar Solder Machine, ...