MoneyDJ reports that TSMC's second fab in Arizona will begin installing equipment for its cutting-edge 3nm node by mid-2026, more than a year ahead of previous ...

Planners say the proposed higher fees for building, especially in the northern part of Phoenix, would pay for infrastructure ...

Stargate appears to be another huge AI data center project on the horizon. Nvidia and TSMC will both benefit from the number of AI chips needed for this venture. The project, meanwhile, will help ...

Additionally, the AI data center infrastructure project of ... Meanwhile, TSMC Chairman Wei Zhejia recently mentioned the difficulties in building a factory in Phoenix, Arizona, at National ...

A news release in November from the U.S. Department of Commerce noted that the Biden administration had awarded TSMC with $6.6 billion in funding for their Phoenix chip facility. This was ...

a city within a city that will form a literal halo around TSMC Arizona's Phoenix campus. At 2,300 acres and $7 billion, the project will support the company's operations and more. Phoenix City ...

These projects ... TSMC’s presence here. Infrastructure for the first phase of Halo Vista is expected to take off in 2025 for an auto mall, retail, office and industrial. The city of Phoenix ...

The quake hit near the city of Chiayi, close to Tainan, where TSMC operates clusters of its most advanced chip plants, supplying artificial intelligence and mobile processors to Nvidia ...

(RTTNews) - Chipmaker Taiwan Semiconductor Manufacturing Co. or TSMC (TSM) resumed operations at all cites after workers were evacuated following an earthquake, reports said citing an emailed ...

Analysts point out that the US regulatory environment is more complex than Taiwan’s, leading to longer timelines and higher costs for TSMC’s Arizona project. “Unlike Taiwan’s streamlined ...

TAIPEI (Reuters) -Chipmaker TSMC said on Tuesday that all its sites were operating following an overnight 6.4 magnitude earthquake in southern Taiwan that was centred on a mountainous rural area ...

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance ...