Credit: VICTOR de SCHWANBERG/SCIENCE PHOTO LIBRARY via Getty Images Scientists have discovered a new quantum state that engineers can harness in a two-dimensional (2D) semiconductor chip to ...

Swave's HXR chip could be the breakthrough we need to enjoy slim, lightweight, low-cost AR glasses without sacrificing quality or battery life.

Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia Tech. Abstract: “3D heterogeneous ...

ValiRx announced on Monday that its wholly-owned subsidiary Inaphaea BioLabs has signed an evaluation and commercial use ...

Image credit: Broadcom ... Hybrid Bonding: Where It Fits into the Future of 3D Chip Stacking Broadcom is trying to usher in the next generation of AI superchips with its 3.5D packaging technology.

Midha says R1 won't stop AI from spending billions.It means they will do more with the compute power they can obtain.

Q1 2025 Earnings Conference Call February 5, 2025 4:30 PM ETCompany ParticipantsMike Watts - Corporate Vice President, ...

In other words, after the chip design is finalized and first silicon ... the idea that it might use 3D V-Cache in some way to improve performance. That particular detail comes from the same ...

It started with perception AI, meaning understanding images, words ... A close-up of a tech engineer soldering a modern system-on-chip circuit board in a laboratory setting.

The Nikon Z50II ($909.95, body only) may seem like only a slight upgrade at a glance—after all, it looks very similar to the ...

Tae Kim: The biggest one that I actually think is happening right now in AI, too, in the late '90s, he had a meeting with his top executives, and it was like, how come all these 3D graphics companies, ...

and more powerful computer chips. Triangular semiconducting particles (pink) are confined within squares to form high-quality elements, layered directly atop other semiconducting materials (depicted ...