Digi Times2d
SK Hynix, Samsung see exports of multi-chip packages fall in January 2025
South Korean memory makers SK Hynix and Samsung Electronics both saw their exports of multi-chip packages (MCP) fall ...
Semiconductor Engineering3y
Future Challenges For Advanced Packaging
Michael Kelly, vice president of advanced packaging development and integration at Amkor ... or even larger pitches if it’s an MCM (multi-chip module). Once again, there are going to be two tiers. The ...
siliconsemiconductor1mon
ASMPT Unveiling Packaging Solutions Enabling the AI World
High-speed data exchange and powerful computing capabilities are crucial in AI applications. Optical communication, known for ...
The Register on MSN4mon
TSMC and Amkor link up to bring advanced packaging stateside
Taiwan's TSMC has inked a deal with US semiconductor ... packaging and testing – were outsourced to Asia. Advanced packaging, ...
Design-Reuse25d
White Electronic Designs Awarded $1.9 Million Contract for System-On-Chip Microprocessor Modules for Air-to-Air Missiles
White's products include advanced semiconductor packaging of high-density memory products and state-of-the-art microelectronic multi-chip modules for military and defense industries and data and ...
Design-Reuse16d
Inapac Technology Unveils Breakthrough Solution for Integrating DRAM in System-in-Package, Multichip Applications
May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...