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Back in early 2020, TSMC Arizona announced that it would invest in the American semiconductor industry, starting with $12 billion to build a semiconductor fabrication plant in Phoenix. In the ...

In addition to the three planned Phoenix fabs, TSMC is rumored ... There is growing pressure for TSMC to bring advanced process node manufacturing to the United States, but Taiwan’s restrictions ...

About 70 to 75 percent of the company’s reclaimed wafers are used for advanced chips with leading process technologies, it said. Phoenix plans to expand its capacity by about 23 percent to 800,000 ...

leading to longer timelines and higher costs for TSMC’s Arizona project. “Unlike Taiwan’s streamlined regulations, the US has a sequential, multi-layered approval process, including ...

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance ...