The quake hit near the city of Chiayi, close to Tainan, where TSMC operates clusters of its most advanced chip plants, supplying artificial intelligence and mobile processors to Nvidia ...

Taiwan Semiconductor Manufacturing Company (TSMC) has said it is unlikely to equip its new US plant in Arizona with its most advanced chip technology ahead of its Taiwan factories, raising ...

At least 15 people sustained minor injuries, including six rescued from a collapsed house in Tainan city, where TSMC operates major fabrication plants. The incident follows April 2024’s more ...

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance ...

Investing.com-- TSMC (NYSE:TSM)- the world’s biggest contract chipmaker, is confident that it will continue to receive U.S. government funding under incoming President Donald Trump, CFO Wendell ...

TL;DR: NVIDIA CEO Jensen Huang is collaborating with TSMC on robotics and autonomous vehicles, including the upcoming Jetson Thor SoC and Project GROOT robot. At a Taiwan event, Huang met with ...

Recap: Nvidia CEO Jensen Huang addressed concerns about the company's demand for advanced packaging from TSMC earlier this week, clarifying that while their technological needs are evolving ...

TSMC has officially commenced mass production of advanced 4nm chips at its Fab 21 facility in Arizona, marking a pivotal milestone in the U.S. semiconductor industry. Confirmed by CEO C.C. Wei ...

The new US plant of Taiwan Semiconductor Manufacturing Co (TSMC) is unlikely to get the most advanced chip technology before factories in Taiwan owing to complex compliance issues, local ...

Apple chipmaker TSMC is currently building its third US-based chip plant in Arizona, thanks to significant grants from the US CHIPS Act. However, the company’s CEO says you shouldn’t expect to ...

TAIPEI : TSMC's new U.S. plant is unlikely to get the most advanced chip technology before factories in Taiwan due to complex compliance issues, local construction regulations and various ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...